The Industry’s smallest wireless low-power NXP i.MX6UL UltraLite System-on-Module platform to build your intelligent and secure connected devices- NXP i.MX6UL-2, ARM® Cortex®-A7 @ 528 MHz, 128 KB L2 cache, with NEON™ MPE (Media Processor Engine) co-processor and programmable smart DMA (SDMA) controller
MEMORY Up to 2 GB NAND flash (SLC), up to 1 GB DDR3
PMIC NXP PF3000
VIDEO/GRAPHICS 2D Pixel Processing Pipeline (PXP) for color-space conversion, scaling, alpha-blending, and rotation, 8-/16-/18-/24-bit parallel LCD Display up to WXGA (1366x768), 8/10/16/24-bit Parallel CSI with BT.656 support
SECURITY** AIS-31 compliant TRNG, ECC/AES256/TDES/ RSA encryption/decryption co-processor, SHA-1/224/256, FameXE PKI co-processor with 4096-bit RSA,/544-bit ECC/ ECDSA support, Secure RTC, Secure JTAG, Secure Storage, Secure Key Management, SPA/DPA/DFA (power/timing/fault attack protection), Tamper Monitor, Digi TrustFence™ Embedded Security Framework
PERIPHERALS/INTERFACES 1 x dedicated MMC 4.5/SD 3.0/SDIO Port (1-/2-4-bit), 2 x USB 2.0 OTG with PHY, 3x I2S/SAI, 1 x S/PDIF Tx/Rx, 2 x FlexCAN (2.0b), 4 x I2C, 4 x SPI, 7 x UART, 4 x Timer, 8 x PWM, 3 x Watchdog, 2 x 12-bit ADC (10 channels) with 4-wire/5-wire touch controller, up to 103 GPIOs
EXTERNAL BUS 16-bit address / up to 16-bit data (multiplexed and non-multiplexed modes)
ETHERNET Dual 10/100 Mbit Ethernet MAC + IEEE 1588
WIRELESS 802.11a/b/g/n/ac 1x1 (MCS 0-9), Bluetooth 4.2 with strong WPA2-Enterprise authentication/encryption for Wi-Fi connections
MCA™ MICROCONTROLLER ASSIST Ultra-low power ARM® Cortex®-M0+, up to 48 MHz (NXP Kinetis KL03: KL03P24M48SF0)
OPERATING TEMPERATURE -40° C to +85° C
STORAGE TEMPERATURE -50° C to +125° C
RELATIVE HUMIDITY Relative humidity 5% to 90% (non-condensing)
ALTITUDE Altitude 12,000 feet (3,658 meters)
RADIO APPROVALS US, Canada, EU, Japan, Australia/New Zealand
EMISSIONS / IMMUNITY / SAFETY FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES-003 Class B, VCCI Class II, AS 3548, FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3, Safety UL/UR (or equivalent)
DESIGN VERIFICATION Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78; Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
MOUNTING / PIN COUNT Common Digi SMTplus* surface mount footprint using 76-pad edge castellated pads (1.27 mm pitch) or 245-pad LGA (1.27 mm pitch) option
MECHANICAL DIMENSIONS 29 mm x 29 mm x 3.5 mm
POWER CONSUMPTION Idle Mode (Linux up, no networking): 100mA @ 5V
Idle Mode (Linux up, with 25% Wi-Fi transmit): 118mA @ 5V
Standby Mode (w/memory refresh): 6mA @ 5V
ULTRA LOW-POWER MODES Event Trigger Mode: 25μA @ 3V (i.MX6UL off, MCA LLS w/HS Comparator active)
Scheduled Wake-Up Mode: 25μA @ 3V (i.MX6UL off, MCA LLS w/HS Comparator active)
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